MPi Logic Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is commonly applied on gold bump and pad wafer testing for Exhibit driver, logic, and memory device. MPI’s cantilever probes are definitely the corresponding solution on the requires of fi­ne pitch, small pad dimension, substantial velocity, less cleaning, multi-DUT, large pin rely, and extremely-lower leakage prerequisites. With excellent craftsmanship, modern architecture and demonstrated methodologies dependant on mechanical and electrical simulation/measurement results, creating MPI the top cantilever provider globally.


FCB Probe Card

The FCB Probe Card is among the most mature technologies of buckling beam probe card. It's aimed to attain the semiconductor ship manufacture time-to-industry (TTM) and cost of test (COT) demand. FCB is usually a proven Alternative for several different semiconductor generation assessments from early engineering pilot-runs to high quantity production (HVM). FCB is ready for gadget requiring superior sign integrity probing (SI) and/or electrical power integrity probing (PI). Applications involve slicing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the whole world’s most effective Total Expense-of-possession (COO) for a variety of DUT applications.


EVS Probe Card

The EVS Probe Card can be an enhancement more than the standard buckling beam probe card. Crucial features are better present carrying potential (C.C.C.) and reduced well balanced Speak to force (BCF), and also General MEMS-like features. EVS can easily meet up with the requirement of State-of-the-art wafer probing. Precise alignment and great planarity Manage tend to be the important components contributing to stable Speak to resistance. With its potential and efficiency, EVS Probe Card is a super choice for Innovative probe playing cards.


Osprey probe card

The Osprey probe card is MPI’s Answer to need for at any time finer pitch. It is made for scaled-down Al pad, and is perfect for very small pitch software with peripheral and complete array pattern. With exact alignment and greater planarity Command, Osprey can attain increased productiveness by multi-DUT structure.  The forming wire (FW) type needle created with MPI’s very own micro fabrication approach not simply provides superior-quality overall performance but additionally makes it possible for uncomplicated needle substitution and shortens protecting cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for check here the demand from customers of small drive probing. In addition it comes along with a chance to fulfill large C.C.C. and large pin counts application. The MEMS procedure guarantees extremely consistent needle characteristics, as well as Distinctive framework layout enables specific alignment and planarity Command.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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